Analysis & Flow Simulation on a Cold Plate with Electronics Housing Assembly

Analysis & Flow Simulation on a Cold Plate with Electronics Housing Assembly

Krishan Kumar #1, Hari Prakash #2, Krishan Kumar Meena#3

#1,2,3Mechanical Engineering Department,

Delhi Technological University, Delhi

Abstract— Flow simulations have been used to determine the surface plot and flow trajectories of a fluid like the temperature and pressure of the solid body and the fluid itself, to cool down electronics housing we use a cold plate so that it won’t overheat. In this report, there is a brief introduction to cold plate and electronics housing and their design in Solid works. And then how we made a split line on electronics housing so that we can apply heat load on it. In this report, we have studied about 3 types of cold plates: - parallel, series, and then the modified series. The material which is chosen is Aluminium because of its high relative strength and low relative weight than other metals, cheap cost and easy availability, and high corrosive resistance. It performs well in harsh atmosphere due to its high robustness and durability, capable of withstanding high impact with high malleable strength. It can put up good guard against electromagnetic interference. But before that, we have done some calculations on heat load and volumetric flow rate so that we can apply them while doing flow simulation. Pressure in parallel and series cases is very high so we have done another case which is modified series, in this case, pressure is less as compared to normal series flow.

Keywords— Flow Simulation, Cold Plate, Heat Transfer, Coolant, Electronic Housing