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ArticlePeer ReviewedOpen AccessPlagiarism Passed
Paper ID:IJSREM60050

Direct–Indirect Evaporative Cooling System

Stream/Area:

-

Subject:

-

Paper ID:

IJSREM60050

Volume:

10 |

4 |

April 2026

Pages:

Publication Frequency:

Monthly (12 issues per year)

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Not assigned

License:International Journal of Scientific Research in Engineering and Management follows the Creative Commons Attribution 4.0 (CC BY 4.0) License, allowing free use and distribution with proper attribution.

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Authors

SF

Shripad Fulari

SB

Sayali Bhosale

PB

Priyanka Bhakare

SS

Sujit Shinde

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Abstract

The Indirect-Direct Evaporative Cooling (IDEC) system represents an advanced power-processing approach to thermal management, specifically engineered to surpass the inefficiencies and high energy consumption of traditional vapor compression systems. By utilizing a multi-phase, two-stage configuration, this system addresses the pressing demand for robust and flexible energy transfer. The first stage employs Indirect Evaporative Cooling (IEC), which acts as a “voltage regulation” phase for temperature, lowering the dry-bulb temperature of the primary air without increasing its moisture content—effectively reducing the intensity of thermal “ripples”. This pre-cooled air then enters the Direct Evaporative Cooling (DEC) stage, where a combined design allows for modularity and scalability essential for evolving cooling demands. The system’s innovation lies in its interleaved operational method, which distributes the thermal and electrical load across multiple stages to minimize component stress, reduce energy dissipation, and eliminate “hot spots” often found in single-phase designs. Integrated with advanced control mechanisms, such as real-time feedback loops and PI-type controllers, the system ensures constant output stability and high transient recovery, even under dynamic load variations or sudden environmental changes.

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Cite This Article

Shripad Fulari, Sayali Bhosale, Priyanka Bhakare, Sujit Shinde, "Direct–Indirect Evaporative Cooling System," International Journal of Scientific Research in Engineering and Management, vol. 10, no. 4, April 2026.

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Publication Date

4/13/2026

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Review Rounds: 2

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The authors declare no conflict of interest related to this research work.

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