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Stream/Area:
-
Subject:
-
Paper ID:
IJSREM68322
Volume:
10 |
10 |
Oct 2026
Pages:
1-10
Publication Frequency:
Monthly (12 issues per year)
License:International Journal of Scientific Research in Engineering and Management follows the Creative Commons Attribution 4.0 (CC BY 4.0) License, allowing free use and distribution with proper attribution.
Science
American International School
Thermoelectric conversion provides a direct means of transforming a temperature difference into electrical energy and is therefore relevant to the recovery of otherwise unused heat. Copper sulfide (CuS) is an attractive thermoelectric host because it combines high electrical transport capability with relatively low thermal conductivity and a defect-rich crystal chemistry. In this work, selenium was introduced into CuS at nominal concentrations of 0.05, 0.10, and 0.15 to regulate both carrier transport and phonon propagation. The resulting Se–CuS materials were examined with respect to their crystal structure, microstrain, crystallite size, electrical conductivity, Seebeck coefficient, thermal conductivity, power factor, and thermoelectric figure of merit. X-ray diffraction confirmed that the characteristic CuS framework was retained after Se incorporation, while the progressive displacement and broadening of the diffraction peaks indicated lattice perturbation. Williamson–Hall analysis showed that the estimated microstrain increased from 4.9 × 10−5 to 8.8 × 10−5, whereas the corresponding crystallite size decreased from about 35.3 to 29.3 nm as the Se content increased. Among the investigated compositions, 0.10 Se–CuS delivered the most favorable combination of thermoelectric properties, giving a Seebeck coefficient of about 52 μV K−1, an electrical conductivity of 830.6 S cm−1, and a power factor of 224.6 μW m−1 K−2 at 300 K. The thermal conductivity was reduced from 2.80 W m−1 K−1 for pristine CuS to 1.85 W m−1 K−1 for the 0.10 composition at 300 K, leading to a calculated maximum ZT of approximately 0.143 at 500 K. Finite-element calculations in COMSOL Multiphysics were additionally used to visualize temperature, heat-flow, and electrical-potential distributions under thermoelectric operating conditions. The results indicate that controlled Se incorporation can introduce useful structural disorder while retaining sufficient electronic transport, thereby providing a route for balancing phononic and electronic contributions in CuS-based thermoelectric materials.
KEYWORDS
Selenium incorporation provides an effective means of modifying the structural and thermoelectric response of CuS while preserving the characteristic host crystal framework. XRD measurements indicate that the CuS phase remains dominant across the investigated Se concentrations, whereas peak displacement and broadening reveal progressive lattice perturbation. Williamson–Hall analysis shows that the microstrain increases from approximately 4.9 × 10−5 to 8.8 × 10−5 while the crystallite size decreases from about 35.3 to 29.3 nm with increasing Se content. The structural disorder introduced by Se is accompanied by changes in both electronic and thermal transport. The 0.10 Se–CuS composition provides the most favorable overall response, with a Seebeck coefficient of approximately 52 μV K−1, electrical conductivity of 830.6 S cm−1, and power factor of 224.6 μW m−1 K−2 at 300 K. Its thermal conductivity is reduced to approximately 1.85 W m−1 K−1 at 300 K, and the calculated ZT reaches about 0.143 at 500 K. Finite-element simulations further show that the optimized Se–CuS element can sustain a substantial temperature gradient while developing an electrical potential, and the modeled Peltier configuration exhibits a corresponding electrothermal response. The lower performance of the 0.15 composition indicates that excessive dopant-induced disorder can begin to impair charge transport. Overall, the results demonstrate that controlled, rather than maximum, Se incorporation is beneficial for balancing electronic and phononic transport in CuS and provides a useful basis for further development of CuS-based thermoelectric materials.
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Publication Date
10/26/2026
Peer Review Type
Double-Blind Peer Review
Review Rounds: 2
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