Modelling for HT Enhancements Using Nano Fluids for Cooling of Electronic Components

The increasing demand for high-performance electronic devices, such as processors and graphics cards, has escalated the challenges associated with heat dissipation. Traditional cooling methods, including air and water cooling, are becoming insufficient as devices generate higher amounts of heat. To address these challenges, the use of nanofluids—suspensions of nanoparticles in base fluids—has emerged as a promising solution for enhancing thermal management. Nanofluids, particularly those containing aluminum oxide (Al₂O₃) and multi-walled carbon nanotubes (MWCNT), have shown superior heat transfer properties compared to conventional fluids due to their high thermal conductivity and enhanced heat transfer performance. This study investigates the impact of nanoparticle concentration, tube diameter, and flow rate on the heat transfer efficiency of Al₂O₃ and MWCNT nanofluids in electronic cooling systems. Using computational fluid dynamics (CFD) simulations and experimental testing, the research aims to provide a comprehensive understanding of how nanofluid properties affect heat dissipation. The findings suggest that increasing nanoparticle concentration significantly enhances heat transfer, with MWCNT-based nanofluids outperforming Al₂O₃ nanofluids in terms of thermal conductivity. The study demonstrates that nanofluids can serve as highly effective coolants for next-generation electronics, offering compact and efficient cooling solutions.